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March 2000 |
Finding
Cracks and |
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A
novel nondestructive testing technique combines
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Figure 1. Crack detection in a ductile iron cast part. |
A crack in a ductile iron part is shown in Figure 1, just before ultrasonic stimulation (above, left). If the crack intersects the surface, the heat source first appears as a line in the IR image, as shown in Figure 1 at center. The line subsequently blurs and broadens into a diffusely heated region surrounding the original line, as shown in Figure 1 at right. When the sound pulse is turned off, the resulting temperature pattern decays according to the usual process of thermal diffusion. This entire process takes place in a fraction of a second, enabling high-speed automated defect inspection.
Note that these images have not been enhanced for contrast. The superb temperature sensitivity of the indium antimonide IR camera makes a fraction of a degree temperature rise stand out in sharp contrast to the surrounding material. Similar images have been obtained with damaged samples of ceramic, carbon, hard plastics, and even walnuts and pistachios. In fact, any hard material with a high emissivity in the mid- or long-wave IR bands can be evaluated.
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Figure 2. ThermoSoniX test station. |
Indigo Systems Corporation has developed a ThermoSoniX test station based on technology developed at Wayne State University and licensed by Indigo Systems. The test station, shown in Figure 2, is primarily intended for hand inspection of low-volume, high-cost parts such as aircraft turbine blades. It is also intended for research and development of fully automated ThermoSoniX inspection systems. The test station consists of the following subsystems:
For many practical applications, this new imaging technique has significant advantages over traditional nondestructive inspection methods. It is fast, wide-area, and sensitive to cracks with any geometrical orientation. ThermoSoniX is not restricted to particular classes of materials, nor does it have the radiation or chemical hazards associated with x-ray imaging or dye penetrants, respectively.
This article was written by Dr. Austin Richards, applications engineer at Indigo Systems Corporation, and Prof. Xiaoyan Han of the department of electrical and computer engineering, Wayne State University, Detroit, MI. For further information, contact Indigo Systems at 5385 Hollister Ave., Suite 103, Santa Barbara, CA 93111; (805) 964-9797; fax: (805) 964-7708; e-mail: richards@indigosystems.com.